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No.169, Science (Kexue) Avenue,National HI-TECH Industry Development Zone, Zhengzhou, China
[email protected]
0086-371-86549132
Nov 28, 2019 · 3.Factors related to processing conditions affecting the surface roughness of grinding. There are factors related to processing conditions including
Grinding Process Grinding is a surface finishing operation where very thin layer of material is removed in the form of dust particles. Thickness of material removed is in range of 0.25 to 0.50 mm. Tool used is a abrasive wheel Grinding machine is a power operated machine tool where, the work piece is fed
Jan 01, 2012 · 1. Introduction. The rotational grinding process is widely used in the production of silicon substrates for semiconductor integrated circuits. The fundamental configuration is regarded as optimum for producing large diameter substrates that meet industry specifications for total thickness variation (TTV) and site flatness (SFQR) , .The process is also used for “backgrinding” after ...
size, and grinding wheel speed. The input process parameters considered are material hardness, work piece speed and depth of cut. The main objective is to predict the surface roughness and achieve optimal operating process parameters. For optimization process Taguchi optimization method and genetic algorithm are used.
value of surface roughness of grinded mild steel work-piece varies from 0.77 µm to 0.79µm. Keywords - Surface grinding process, Surface roughness, Mild steel specimen I. IntroductIon The grinding process is the material removal and surface process to shape the finish part of any materials example steel, aluminum alloys and the others.
Grit cutting depth model for wafer rotational grinding is established by calculating the material removal area based on two equivalent approaches: the kinematic relation in rotational grinding (macroscale approach) and the cutting area of effective grits (microscale approach), as shown in Fig. 1.In the macroscale approach, theoretical area of the removed material (A w-p) is calculated based on ...
on grinding process can be utilized to predict the grinding behavior and achieve optimal operating processes parameters. The knowledge is mainly in the form of physical and empirical models which describe various aspects of grinding process. The main objective in any machining process is to minimize the surface roughness (Ra).In order to
May 20, 2018 · Abstract. This paper presents an attempt to robotize the grinding process and to overcome grinding vibrations and chattering. The objective is to have a finished workpiece with a high quality of the final surface. In order to achieve that, we started by choosing the right strategy to grind the workpiece that has uneven initial surface.
on local normal force control. Test results show significant relative improvements in levels of surface roughness and a reduction in the normal spatial variation. Keywords: Grinding; Control; Silicon. 1 Introduction The rotational grinding process is widely used in the production of silicon substrates for semiconductorintegrated circuits.
value of surface roughness of grinded mild steel work-piece varies from 0.77 µm to 0.79µm. Keywords - Surface grinding process, Surface roughness, Mild steel specimen I. IntroductIon The grinding process is the material removal and surface process to shape the finish part of any materials example steel, aluminum alloys and the others.
Furthermore, the results of the confirmation experiments reveal that the obtained optimal combination of the grinding parameters can effectively improve surface roughness. II. ELID GRINDING TECHNIQUE A. Principle of ELID GrindingThe schematic representation of the experimental set up of the ELID grinding process is shown in Figure 1 Initial ...
Mar 27, 2014 · Experimental set up: A Series of experiment have been conducted to evaluate the influence of grinding process parameters on surface roughness and material removal rate in cylindrical grinding. The test was carried out on high precision cylindrical grinding machine with vitrified Al2O3 (A60 M6 VCNM) grinding wheel and water miscible coo- lant ...
Abstract and Figures. Self-rotating grinding is the most widely used technology to thin silicon wafer. The roughness is an important indicator of thinning quality and processing accuracy. To get a ...
main effects as well as the interaction effects of three process parameters (wheel rotational speed, chuck rotational speed and feed- rate). The process outputs studied include grinding force, spindle motor current, cycle time, surface roughness and grinding marks.
The prediction of the parameters of grinding process is essential to quantify surface roughness, which is one of the significant quality limitations for the selection of grinding parameters in process planning. Usually, practical knowledge gained by the process planners and help of data handbooks is used to select the grinding parameters [1, 2].
Jun 30, 2009 · Surface Roughness Produced by Different Manufacturing Process. Knowing what manufacturing process can produce surface finishes that desired on a surface can be an added advantage while making the designs. Here is a table showing maximum and minimum Ra values can produced on each production methods. Elect. Discharge Machining. Perm. Mold Casting.
mond grinder wheel. This abrasive grinding process provides really good surface roughness and sharp cutting edge although its machining efficiency is extremely low. In order to improve the mate-rial removal rate when manufacturing PCD tools, electrical discharge grinding (EDG), a variation of
Wafer rotational grinding is widely employed for back-thinning and flattening of semiconducting wafers during the manufacturing process of integrated circuits. Grit cutting depth is a comprehensive indicator that characterizes overall grinding conditions, such as the wheel structure, geometry, abrasive grit size, and grinding parameters.
For surface grinding operations, the process parameters, i.e. the linear feed, the cross feed, and the depth of cut, have a direct influence on the roughness of the ground surface.Higher values of any of them would result in a higher material removal rate, and therefore, a
The invention relates to an apparatus and process for machining a rotating workpiece by means of rotary ultrasonic grinding. The apparatus performs rotary ultrasonic grinding by rotating and vibrating a surface finishing tool in contact with a rotating workpiece. The rotary ultrasonic grinding process is a hybridized method which comprises a combination of conventional ultrasonic machining and ...
CiteSeerX - Document Details (Isaac Councill, Lee Giles, Pradeep Teregowda): Surface grinding is the most common process used in the manufacturing sector to produce smooth finish on flat surfaces. Surface quality and metal removal rate are the two important performance characteristics to be considered in the grinding process. The economics of the machining process is affected by several ...
any machining process is to maximize the Metal Removal Rate (MRR) and to minimize the surface roughness (Ra). In order to optimize these values Taguchi method, ANOVA and regression analysis is used. Keyword : Surface Grinding,Optimazation Process,Taguchi Method,ANOVA,feed,speed,depth of cut,surface roughness. 1. INTRODUCTION
Some research strongly focused on reducing surface roughness determining optimal process parameters by establishing a surface roughness prediction model in order to get better product quality. Zhao et al. [7] and Yong et al. [8] investigated the grinding and grinding process of IBR of aero-engine
grinding. Furthermore, the process model can be used for grinding force (or power) estimation for multiple-stage grinding cycles which includes rough, semi-finish, finish, and spark out. Therefore, the grinding process design can be carried out proactively while eliminating „trial and error‟.
Dec 23, 2018 · The grinding machine provides high accuracy and fine surface finish with minimum tolerances. The machining process is done by the abrasive action of the grinding wheel; the abrasives are embedded over the periphery of the rotating wheel. In Grinding machine grinding wheel is work as a cutting tool and responsible for all machining processes.
Work speed, feed rate and depth of cut are the input process parameters of cylindrical grinding process. The objective of this work is to predict the grinding behavior and is available through best operational processes parameters on EN 24. Surface roughness is an important output response within the production with
Precision prediction of machined surface roughness is challenging facing the robotic belt grinding of complex blade, since this process is accompanied with significant elastic deformation.
roughness parameter Sa was recorded. For the grinding process a grinding wheel with the designation 1A1 D100 U10 X10 H20 Y0,2 MDX-587 ES D64 C115 was used. It is a diamond grinding wheel type 1A1 with a rectangular cross-section with a metal bond, 100 mm in diameter and 10 mm wide, with an average diameter of 64 μm diamond grain and its C 115 ...
Dec 16, 2014 · The results showed that grain size significantly affected the grinding forces and surface roughness values. Increasing grain size and depth of cut increased the grinding forces and surface roughness values. Pil-Ho [21] et. al. have researched grinding process for surface roughness, grinding force and tool wear.
The Backgrinding Process. To improve the productivity of an operation, a multi-step grinding operation is generally performed. The first step uses a large grit to coarsely grind the wafer and remove the bulk of the excess wafer thickness. A finer grit is used in the second step to polish the wafer and to accurately grind the wafer to the ...
This process cannot grind the entire work part resulting in lower production rates than external grinding. creep feed grinding used for cuts 1000 to 10000 times greater than conventional grinding. to accomplish this the grinder is fed slowly. can be used for flat and cylindrical objects alike. aka deep grinding in europe
on local normal force control. Test results show significant relative improvements in levels of surface roughness and a reduction in the normal spatial variation. Keywords: Grinding; Control; Silicon. 1 Introduction The rotational grinding process is widely used in the production of silicon substrates for semiconductorintegrated circuits.
Nov 01, 2005 · This paper presents a new analytical model for the prediction of arithmetic mean surface roughness based on the stochastic nature of grinding process, governed mainly by the random geometry of grain and random distribution of cutting edges on the wheel surface having random grain protrusion heights.
the grinding thickness was controlled at 0.1 m. The experiments utilized #325 metal-bonded and #8000 ceramic-bonded diamond grinding wheels, with deionized water as a coolant. The experimental parameters are shown in Table1. Table 1. Grinding conditions used in experiments. Process No. Grinding Wheel Type (Abrasive Grain Size) Feed Rate fs ( m/s)
Dec 01, 2010 · Abstract. Machining operations have been the core of the manufacturing industry since the industrial revolution. Machining is a process of material removal using cutting tools and machine tools to accurately obtain the required product dimensions with good surface finish. The manufacturing industries strive to achieve either a minimum cost of ...
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